Accelerated Life Testing

simulates years of real-world stress—such as temperature extremes, humidity, vibration, and power cycling—in a condensed timeframe to uncover early failure mechanisms and predict long-term reliability. By applying elevated stress conditions, we validate product robustness and ensure compliance with industry standards like JEDEC JESD47 and JESD22-A108.

Authentication Testing / Counterfeit Mitigation

Combines advanced chemical, visual, and analytical techniques—including Dynasolve 750 and Methyl/Pyrrolidone testing, XRF, X-ray, and surface texture analysis—to expose remarking, resurfacing, and material inconsistencies. Through rigorous inspections like hermeticity testing, HTT, and mark permanency validation, we ensure component authenticity, safeguard supply chains, and protect performance integrity.

Device Characterization Testing

Delivers deep insights into semiconductor performance by measuring key electrical parameters such as current-voltage (I-V), capacitance-voltage (C-V), switching behavior, and ON-resistance. These evaluations ensure each device meets design specifications and operates reliably under real-world conditions, supporting quality assurance from prototyping to production.

Ball / Die Sheer Testing

Evaluates the mechanical integrity of semiconductor interconnects by applying precise lateral force to solder balls, wire bonds, and die attachments. These tests measure bond strength, detect weak connections, and ensure durability across high-reliability applications, supporting quality assurance from assembly to deployment.

ESD-Electronic Static Discharge Test

Safeguards sensitive components against electrostatic damage using industry-standard models: Charged Device Model (CDM), Human Body Model (HBM), and IEC 61000-4-2. These tests simulate real-world discharge events to validate product resilience, ensure compliance, and protect performance from design through deployment.

Material Analysis

Utilizes advanced techniques like Energy Dispersive X-ray Spectroscopy (EDS) and X-ray Fluorescence (XRF) to accurately identify elemental composition and detect material inconsistencies. These methods ensure precise characterization of semiconductor components, supporting quality assurance, counterfeit detection, and compliance across critical applications.

Other Level III & Sub System Testing

Validate semiconductor components within integrated environments—ensuring functionality, compatibility, and performance under real-world operating conditions. By simulating end-use scenarios across complex assemblies, we uncover latent defects and optimize system reliability for mission-critical applications.

Radiation Effect Test

Evaluates semiconductor components under ionizing environments to identify vulnerabilities such as single-event effects, total ionizing dose damage, and displacement damage. These tests ensure device reliability in space, nuclear, and high-altitude applications, supporting compliance with standards like MIL-STD-883 and NASA NEPP protocols.

Temperature / Power Cycle Operating Life Testing

Subjects semiconductor components to repeated thermal and electrical stress—cycling between high and low temperatures while applying power—to simulate long-term field conditions. This accelerated reliability test uncovers latent defects, validates thermal stability, and ensures durability across mission-critical applications in compliance with JEDEC and AEC-Q standards.

Thermal Shock Testing

Subjects semiconductor components to extreme temperature transitions—moving them between hot and cold zones within seconds—to simulate harsh real-world conditions. This high-reliability method reveals early-life failures such as solder joint cracks, delamination, and material fatigue, ensuring durability in aerospace, automotive, and defense applications.

Need more details or don’t see the test you’re looking for?

We offer a wide range of testing services beyond what’s listed—so if you need additional information or a specific test not shown, don’t hesitate to contact us. Our team is here to help tailor solutions to your exact requirements.

Autoclave Testing

Evaluates moisture resistance in non-hermetic semiconductor packaging by subjecting components to high temperature, high pressure, and 100% humidity conditions. This accelerated “steam bomb” method reveals potential failure points caused by moisture ingress—ensuring long-term reliability and compliance with JEDEC standards.

EFR Analysis Testing

Identifies latent defects in semiconductor components by simulating initial operating conditions and monitoring performance during the critical early-life phase. This proactive approach helps reduce field failures, improve product reliability, and ensure compliance with industry standards like JEDEC JESD74A.

Reliabitlity Testing

Ensure semiconductor components perform consistently over time by simulating accelerated stress conditions such as temperature, humidity, voltage, and mechanical shock. Through rigorous JEDEC-compliant methods, we uncover potential failure mechanisms early—delivering proven durability and confidence from design to deployment

Shadow Moire / Warpage Analysis Testing

Provides high-resolution, non-destructive measurement of surface deformation and package flatness under thermal stress. By capturing interference patterns across semiconductor assemblies, we detect warpage early—ensuring dimensional stability, process control, and long-term reliability in advanced packaging applications.

Acoustic Microscopy Testing

Uses high-frequency ultrasound to non-destructively detect internal defects such as delamination, voids, and cracks within semiconductor components. This precision imaging technique ensures structural integrity and reliability across chip packaging, bonding layers, and advanced assemblies.

Environmental testing

Ensures product reliability under extreme conditions—evaluating high and low temperature operating limits (HTOL/LTOL), long-term thermal exposure (HTSL), and accelerated stress scenarios (HAST and THB). These rigorous tests simulate real-world environments to uncover latent failures, validate durability, and safeguard performance across the full lifecycle.

Fine/Gross Leak - Kr85 Testing

Using Krypton-85 (Kr85) provides ultra-sensitive hermeticity validation for semiconductor packages by detecting even the smallest leak paths through radioactive tracer gas analysis. This non-destructive method ensures long-term reliability and compliance with military, aerospace, and medical standards by pinpointing seal integrity failures with unmatched precision.

Latch-up Test

Ensures robust protection against parasitic failures by simulating real-world electrical stress conditions using CDM, HBM, IEC, MM, and dynamic latch-up methodologies. These tests validate semiconductor resilience under power surges and transient events, safeguarding long-term reliability and compliance with global standards.

Mechanical Shock Testing

Evaluates the durability of semiconductor components by subjecting them to sudden, high-intensity acceleration pulses—simulating real-world impacts from handling, transport, or field operation. Using industry standards like MIL-STD-883 and MIL-STD-750, we detect structural weaknesses and ensure long-term reliability in mission-critical environments.

Particle Impact Noise Dectection ( PIND)

Identifies loose particles within semiconductor device cavities by applying controlled mechanical shock and vibration, simulating dynamic environments. This non-destructive method ensures internal cleanliness and reliability, meeting stringent standards like MIL-STD-883 and MIL-STD-750 for high-reliability applications.

Low Temperatue Operation Life Testing

Subjects semiconductor devices to prolonged electrical bias under extreme cold conditions—typically between -40 °C and -65 °C—to simulate sub-zero field environments. This accelerated stress test reveals cold-induced failure mechanisms such as hot carrier degradation, material contraction, and insulation breakdown, ensuring reliability for aerospace, military, and high-altitude applications.

MIL STD Testing

ensure compliance with rigorous military and aerospace standards—including D4727, D5118M, JEDEC, MIL-STD-202, 750, 883, and NASA specifications—covering electrical, mechanical, and environmental performance. From packaging validation (MIL-STD-3010) to destructive physical analysis (MIL-STD-1580), we deliver trusted quality assurance that meets the most demanding supplier and defense requirements.

Plastic Encapsulated Microcircuit Qualification (PEM)

screen and upscreen commercial off-the-shelf (COTS) devices to meet high-reliability standards for aerospace, defense, and space applications. Through rigorous testing aligned with NASA, MIL-STD, and JEDEC protocols, we ensure PEMs deliver dependable performance in harsh environments while offering cost, size, and weight advantages over hermetic alternatives

Salt Atmosphere Testing

Exposes semiconductor components to a controlled mist of salt solution under elevated temperature and humidity—simulating harsh marine or corrosive environments. This accelerated corrosion test reveals vulnerabilities in coatings, seals, and materials, ensuring long-term reliability and compliance with standards like MIL-STD-883 Method 1009.

Soldering Test

Evaluates the solderability and mechanical integrity of component leads, terminations, and PCB pads using industry-standard methods like dip-and-look, wetting balance, and surface mount simulation. These tests ensure reliable electrical connections, detect plating or contamination issues, and support compliance with standards such as MIL-STD-883 and J-STD-002.

Vibration Testing

Simulate real-world mechanical stresses by subjecting semiconductor components to controlled sinusoidal and random vibration across multiple axes and frequency ranges. This testing identifies structural weaknesses, ensures mechanical robustness, and validates compliance with standards like MIL-STD-883, MIL-STD-750, and IEC 60068-2-6 for high-reliability applications.

Elecrical Testing Services

Validates performance across the full spectrum of semiconductor technologies—from AC/DC parametric analysis and DDR memory testing to advanced digital, analog, mixed-signal, and RF components. We support everything from ASICs, FPGAs, and microprocessors to MLCCs, transceivers, and transistor modules, ensuring precision, compliance, and reliability through JTAG, boundary scan, and programming services.

Failure Analysis

Combines advanced electrical, chemical, and visual diagnostics—including X-ray, XRF, surface texture analysis, hermeticity testing, and parametric evaluation—to uncover root causes, validate reliability, and protect the integrity of semiconductor components across the full lifecycle.

High Temperature Operation Life Testing (HTOL)

Subjects semiconductor devices to elevated temperatures and electrical stress over extended periods to accelerate aging and reveal latent failure mechanisms. This critical reliability test ensures long-term performance and compliance with JEDEC JESD22-A108, supporting robust qualification for automotive, aerospace, and industrial applications.