Manufacturing Services

From wafer to assembly—built for longevity.

Orora Technology offers a full suite of manufacturing solutions—from targeted services to full production—designed to accelerate time-to-market and ensure product longevity.

    • Custom wire harnesses (multi-branch, shielded, twisted pair)

    • Coaxial and RF cable assemblies

    • Flat ribbon cables

    • Power cables (AC/DC)

    • Data cables (USB, Ethernet, HDMI)

    • Overmolded assemblies

    • MIL-SPEC and aerospace-grade harnesses

    • Labeling, strain relief, and connectorized ends

    • Board-to-board connectors (headers, sockets)

    • Wire-to-board and wire-to-wire connectors

    • Circular connectors (metal/plastic shell)

    • RF connectors (SMA, BNC, TNC)

    • High-speed data connectors (USB-C, HDMI, DisplayPort)

    • Waterproof and sealed connectors (IP-rated)

    • Modular jacks and plugs

    • Custom pinout configurations

    • Motor and actuator assemblies

    • Switch and relay modules

    • Fan and cooling assemblies

    • Enclosure-integrated electronics

    • Control panels and interface modules

    • Solenoid and sensor integration

    • DIN rail and rack-mounted subassemblies

    • Cable-to-enclosure routing and strain relief

    • Lens assemblies (single or multi-element)

    • Optical sensor modules (IR, UV, visible)

    • Light guide and fiber optic integration

    • LED arrays with optical diffusers

    • Filter-mounted enclosures

    • Camera module integration

    • Precision-aligned optical subassemblies

    • Cleanroom-assembled optical units

    • Resistor networks and arrays

    • Capacitor banks (ceramic, electrolytic, film)

    • Inductor coils and chokes

    • EMI/RFI filters

    • Transformers and magnetic assemblies

    • Custom passive component groupings

    • Surface-mount and through-hole configuration

    • Microcontroller

    • Modules

    • Memory chip assemblies (Flash, EEPROM, DRAM)

    • FPGA and CPLD integrated boards

    • ASIC-mounted subassemblies

    • Sensor IC integration (temperature, pressure, motion)

    • Secure firmware-loaded devices

    • Programmable logic modules

    • Custom-configured semiconductor package

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