Value-Added Services

Orora’s asset disposition services ensure secure, compliant, and cost-effective removal of end-of-life components—from semiconductors to electromechanical hardware. We maximize recovery value while managing the full lifecycle with sustainability and traceability at every step

Electronic components are baked to safely remove moisture and prevent damage during high-temperature soldering processes. This ensures product reliability, protects against defects like popcorning, and supports long-term performance in critical applications.

We securely collect, recycle, and dispose of all types of electronic waste, with a focus on protecting private data and the environment. Our services cover medical, telecom, and electronic components—tailored to meet your needs with full data protection.

We offer custom kitting services that organize and package electronic components into ready-to-use kits tailored to your production needs. This streamlines assembly, reduces sourcing complexity, and ensures every part arrives accurately and efficiently for manufacturing.

We offer precision marking and remarking services for electronic components, ensuring clear identification, traceability, and compliance with industry standards. Whether correcting mislabels or applying custom part numbers and logos, our process uses advanced laser technology to preserve component integrity without thermal damage.

We deliver advanced programming electronic parts to ensure precise functionality, seamless integration, and optimal performance across systems. Our services cover firmware loading and device configuration for components such as microcontrollers, memory chips, and programmable ICs.

We provide relabeling services for electronic components, ensuring accurate identification, traceability, and compliance with customer or regulatory requirements. Whether updating part numbers, correcting mislabels, or applying custom branding, our process maintains component integrity and quality.

We offer reverse logistics and repair services to recover, refurbish, and restore electronic components and systems with full traceability and quality assurance. From diagnostics to reconditioning, our process minimizes waste, extends product life, and supports a more sustainable supply chain.

We offer precision tape and reeling services to package electronic components in production-ready formats, ensuring seamless integration with automated assembly lines. This process enhances handling efficiency, protects sensitive parts from damage, and supports high-volume manufacturing with speed and accuracy.

We support precision tinning services for electronic components to restore solderability, remove oxidation, and ensure reliable performance during assembly. The process meets industry standards for high-reliability applications, including mitigation of tin whiskers and gold embrittlement.

We offer up-screening services to qualify commercial-grade electronic components for industrial or military-grade applications. Through rigorous testing and environmental screening, we ensure each part meets enhanced reliability, temperature, and performance standards required for demanding environments.

We offer precision wafer processing services—including dicing, thinning, polishing, and inspection—to support semiconductor manufacturing and device integration. Our secure wafer storage solutions ensure preservation of die and substrate inventory.