MEMORY SPECIFICATION SHEET
Guidelines for Product Reproduction & Manufacturing
MEMORY—In the semiconductor space, memory technologies are fundamental to system performance, data integrity, and product longevity. Non-volatile memory—including EEPROM, NV-SRAM, Flash (NOR and NAND), FRAM, and eMMC—retains data even when power is removed, making it essential for firmware storage, secure data retention, and embedded applications. These components are critical in devices that require long-term reliability and fast boot-up. On the other hand, volatile memory—such as DRAM (DDR3, DDR4, LPDDR variants), SRAM (asynchronous, synchronous, low-power), FIFO, and Dual-Port RAM—offers high-speed, temporary data access for real-time processing, buffering, and system responsiveness. Together, these memory types enable everything from mobile devices and industrial controllers to automotive systems and cloud infrastructure, making them indispensable in modern electronics design and manufacturing.
Orora’s enables the reproduction and manufacturing of both volatile and non-volatile memory components—such as EEPROM, NV-SRAM, Flash, FRAM, DRAM, and SRAM—by leveraging advanced wafer-level processing and die-level preservation techniques. Through its specialized lab capabilities, Orora performs precision wafer processing and securely stores known-good die, ensuring long-term availability of critical memory types that are often discontinued or constrained by global shortages. This approach allows semiconductor companies and OEMs to maintain legacy systems, extend product lifecycles, and avoid costly redesigns by accessing reliable, drop-in memory solutions tailored to their exact specifications.
