Orora Technology supports a broad range of advanced test platforms designed to ensure product reliability, authenticity, and performance. Authentication and Counterfeit Mitigation services verify product authenticity and eliminate suspect components. Accelerated Life Testing simulates extended usage to validate long-term durability. Additionally, our Electrical Testing Services confirm that products meet or exceed their original electrical performance specifications.

Accelerated Life Testing 

Simulates years of real-world stress—such as temperature extremes, humidity, vibration, and power cycling—in a condensed timeframe to uncover early failure mechanisms and predict long-term reliability. By applying elevated stress conditions, it allows for validation of product robustness and ensures compliance with industry standards like JEDEC JESD47 and JESD22-A108.

Authentication Testing / Counterfeit Mitigation 

Uses advanced chemical and analytical methods—such as Dynasolve testing, XRF, and X-ray—to detect remarking, resurfacing, and material flaws. Rigorous inspections like hermeticity and mark permanency testing ensure authenticity, protect supply chains, and uphold performance integrity.

Acoustic Microscopy Testing

Uses high-frequency ultrasound to non-destructively detect internal defects such as delamination, voids, and cracks within semiconductor components. This precision imaging technique ensures structural integrity and reliability across chip packaging, bonding layers, and advanced assemblies.

Device Characterization Testing 

Delivers deep insights into semiconductor performance by measuring key electrical parameters such as current-voltage (I-V), capacitance-voltage (C-V), switching behavior, and ON-resistance. Each device meets design specifications and operates reliably under real-world conditions, supporting quality assurance from prototyping to production.

Ball / Die Sheer Testing

Evaluates the mechanical integrity of semiconductor interconnects by applying precise lateral force to solder balls, wire bonds, and die attachments. These tests measure bond strength, detect weak connections, and ensure durability across high-reliability applications, supporting quality assurance from assembly to deployment.

Autoclave Testing

Evaluates moisture resistance in non-hermetic semiconductor packaging by subjecting components to high temperature, high pressure, and 100% humidity conditions. This accelerated “steam bomb” method reveals potential failure points caused by moisture ingress—ensuring long-term reliability and compliance with JEDEC standards.

EFR Analysis Testing

Identifies latent defects in semiconductor components by simulating initial operating conditions and monitoring performance during the critical early-life phase. This proactive approach helps reduce field failures, improve product reliability, and ensure compliance with industry standards like JEDEC JESD74A.

Environmental testing 

Ensures product reliability under extreme conditions—evaluating high and low temperature operating limits (HTOL/LTOL), long-term thermal exposure (HTSL), and accelerated stress scenarios (HAST and THB). These rigorous tests simulate real-world environments to uncover latent failures, validate durability, and safeguard performance across the full lifecycle.

Functional & In-Circuit Testing

Ensures complete validation of semiconductor assemblies—from verifying individual component integrity and electrical connections to simulating real-world operating conditions. By combining ICT and FCT methodologies, manufacturing defects are identified early and confirm end-product performance, delivering reliable, production-ready solutions.

Elecrical Testing Services

Validates performance across the full spectrum of semiconductor technologies—from AC/DC parametric analysis and DDR memory testing to advanced digital, analog, mixed-signal, and RF components. Components like ASICs, FPGAs, and MLCCs are configured and validated via JTAG, boundary scan, and advanced programming to ensure reliable performance.

ESD-Electronic Static Discharge Test

Safeguards sensitive components against electrostatic damage using industry-standard models: Charged Device Model (CDM), Human Body Model (HBM), and IEC 61000-4-2. These tests simulate real-world discharge events to validate product resilience, ensure compliance, and protect performance from design through deployment.

Failure Analysis

Combines advanced electrical, chemical, and visual diagnostics—including X-ray, XRF, surface texture analysis, hermeticity testing, and parametric evaluation—to uncover root causes, validate reliability, and protect the integrity of semiconductor components across the full lifecycle.

Latch-up Test 

Ensures robust protection against parasitic failures by simulating real-world electrical stress conditions using CDM, HBM, IEC, MM, and dynamic latch-up methodologies. These validate semiconductor resilience under power surges and transient events, safeguarding long-term reliability and compliance with global standards.

High Temperature Operation Life Testing (HTOL)

Subjects semiconductor devices to elevated temperatures and electrical stress over extended periods to accelerate aging and reveal latent failure mechanisms. This testing ensures long-term performance and compliance with JEDEC JESD22-A108, supporting robust qualification for automotive, aerospace, and industrial applications.

Vibration Testing 

Simulate real-world mechanical stresses by subjecting semiconductor components to controlled sinusoidal and random vibration across multiple axes and frequency ranges. This testing identifies structural weaknesses, ensures mechanical robustness, and validates compliance with standards like MIL-STD-883, MIL-STD-750, and IEC 60068-2-6 for high-reliability applications.

Material Analysis

Utilizes advanced techniques like Energy Dispersive X-ray Spectroscopy (EDS) and X-ray Fluorescence (XRF) to accurately identify elemental composition and detect material inconsistencies. These methods ensure precise characterization of semiconductor components, supporting quality assurance, counterfeit detection, and compliance across critical applications.

Mechanical Shock Testing

Evaluates the durability of semiconductor components by subjecting them to sudden, high-intensity acceleration pulses—simulating real-world impacts from handling, transport, or field operation. Using industry standards like MIL-STD-883 and MIL-STD-750, detects structural weaknesses and ensure long-term reliability in mission-critical environments.

Low Temperatue Operation Life Testing

Subjects semiconductor devices to prolonged electrical bias under extreme cold conditions—typically between -40 °C and -65 °C—to simulate sub-zero field environments. This accelerated stress test reveals cold-induced failure mechanisms such as hot carrier degradation, material contraction, and insulation breakdown, ensuring reliability for aerospace, military, and high-altitude applications.

Other Level III & Sub System Testing

Validate semiconductor components within integrated environments—ensuring functionality, compatibility, and performance under real-world operating conditions. By simulating end-use scenarios across complex assemblies,  the test uncovers latent defects and optimize system reliability for mission-critical applications.

Particle Impact Noise Dectection ( PIND)

Identifies loose particles within semiconductor device cavities by applying controlled mechanical shock and vibration, simulating dynamic environments. This non-destructive method ensures internal cleanliness and reliability, meeting stringent standards like MIL-STD-883 and MIL-STD-750 for high-reliability applications.

MIL STD Testing

Ensures compliance with rigorous military and aerospace standards—including D4727, D5118M, JEDEC, MIL-STD-202, 750, 883, and NASA specifications—covering electrical, mechanical, and environmental performance. From packaging validation (MIL-STD-3010) to destructive physical analysis (MIL-STD-1580), these quality assurance processes meet the most demanding supplier and defense requirements with proven reliability.

Radiation Effect Test

Evaluates semiconductor components under ionizing environments to identify vulnerabilities such as single-event effects, total ionizing dose damage, and displacement damage. These tests ensure device reliability in space, nuclear, and high-altitude applications, supporting compliance with standards like MIL-STD-883 and NASA NEPP protocols.

Reliabitlity Testing

Ensure semiconductor components perform consistently over time by simulating accelerated stress conditions such as temperature, humidity, voltage, and mechanical shock. Through rigorous JEDEC-compliant methods, potential failure mechanisms are uncovered early—delivering proven durability and confidence from design to deployment

Plastic Encapsulated Microcircuit Qualification (PEM)

screen and upscreen commercial off-the-shelf (COTS) devices to meet high-reliability standards for aerospace, defense, and space applications. Through rigorous testing aligned with NASA, MIL-STD, and JEDEC protocols,  PEMs deliver dependable performance in harsh environments while offering cost, size, and weight advantages over hermetic alternatives

Semiconductor Testing & Characterization

Deliver precise evaluation of device performance through electrical, thermal, and functional analysis—covering key parameters like I-V, C-V, switching behavior, and ON-resistance. These tests ensure each component meets design specifications, operates reliably under real-world conditions, and complies with industry standards from prototyping to production.

Salt Atmosphere Testing

Exposes semiconductor components to a controlled mist of salt solution under elevated temperature and humidity—simulating harsh marine or corrosive environments. This accelerated corrosion test reveals vulnerabilities in coatings, seals, and materials, ensuring long-term reliability and compliance with standards like MIL-STD-883 Method 1009.

Shadow Moire / Warpage Analysis Testing

Provides high-resolution, non-destructive measurement of surface deformation and package flatness under thermal stress. By capturing interference patterns across semiconductor assemblies,  warpage is detected early—ensuring dimensional stability, process control, and long-term reliability in advanced packaging applications.

Orora’s testing ensures your technology performs when it matters most. We work with you to accelerate innovation, reduce risk, and bring your vision to life.